CVE-2023-21671
9.3
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Summary
Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
Affected Software
| Vendor | Product | Version Range | Status |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon | FastConnect 6700 | affected |
| Qualcomm, Inc. | Snapdragon | FastConnect 6900 | affected |
| Qualcomm, Inc. | Snapdragon | QCA6391 | affected |
| Qualcomm, Inc. | Snapdragon | QCM6490 | affected |
| Qualcomm, Inc. | Snapdragon | QCS6490 | affected |
| Qualcomm, Inc. | Snapdragon | QSM8350 | affected |
| Qualcomm, Inc. | Snapdragon | Qualcomm Video Collaboration VC3 Platform | affected |
| Qualcomm, Inc. | Snapdragon | SD888 | affected |
| Qualcomm, Inc. | Snapdragon | SM7315 | affected |
| Qualcomm, Inc. | Snapdragon | SM7325P | affected |
| Qualcomm, Inc. | Snapdragon | Snapdragon 778G 5G Mobile Platform | affected |
| Qualcomm, Inc. | Snapdragon | Snapdragon 778G+ 5G Mobile Platform (SM7325-AE) | affected |
| Qualcomm, Inc. | Snapdragon | Snapdragon 780G 5G Mobile Platform | affected |
| Qualcomm, Inc. | Snapdragon | Snapdragon 782G Mobile Platform (SM7325-AF) | affected |
| Qualcomm, Inc. | Snapdragon | Snapdragon 7c+ Gen 3 Compute | affected |
| Qualcomm, Inc. | Snapdragon | Snapdragon 888 5G Mobile Platform | affected |
| Qualcomm, Inc. | Snapdragon | Snapdragon 888+ 5G Mobile Platform (SM8350-AC) | affected |
| Qualcomm, Inc. | Snapdragon | WCD9370 | affected |
| Qualcomm, Inc. | Snapdragon | WCD9375 | affected |
| Qualcomm, Inc. | Snapdragon | WCD9380 | affected |
| Qualcomm, Inc. | Snapdragon | WCD9385 | affected |
| Qualcomm, Inc. | Snapdragon | WCN6740 | affected |
| Qualcomm, Inc. | Snapdragon | WSA8830 | affected |
| Qualcomm, Inc. | Snapdragon | WSA8835 | affected |
Weaknesses
- CWE-20: CWE-20 Improper Input Validation
ADP Enrichment
CVE Program Container
Additional References
CISA ADP Vulnrichment
- SSVC:
- Exploitation: none
- Automatable: no
- Technical Impact: total
References
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