CVE-2021-30331

Summary

Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

Affected Software

VendorProductVersion RangeStatus
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon WearablesAR8035, FSM10055, FSM10056, MDM9150, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6125, QCM6490, QCS2290, QCS410, QCS4290, QCS610, QCS6125, QCS6490, QCX315, SD 675, SD 8 Gen1 5G, SD460, SD480, SD662, SD665, SD675, SD678, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD778G, SD865 5G, SD870, SD888 5G, SDX55, SDX55M, SDX65, SDXR2 5G, SM6225, SM6250, SM6250P, SM6375, SM7250P, SM7325P, SW5100, SW5100P, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3991, WCN3998, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835affected

Weaknesses

  • Information Exposure in Data Modem

ADP Enrichment

CVE Program Container

Additional References

References