CVE-2020-11208
N/A
N/A
Summary
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
Affected Software
| Vendor | Product | Version Range | Status |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile | SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439 | affected |
Weaknesses
- Buffer Overflow in DSP Process
ADP Enrichment
CVE Program Container
Additional References
- https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
- https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
- https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/
References
- https://www.qualcomm.com/company/product-security/bulletins/november-2020-bulletin
- https://blog.checkpoint.com/2020/08/06/achilles-small-chip-big-peril/
- https://research.checkpoint.com/2021/pwn2own-qualcomm-dsp/
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