CVE-2017-18302
N/A
N/A
Summary
In Snapdragon (Automobile ,Mobile) in version MSM8996AU, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, a crafted HLOS client can modify the structure in memory passed to a QSEE application between the time of check and the time of use, resulting in arbitrary writes to TZ kernel memory regions.
Affected Software
| Vendor | Product | Version Range | Status |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Automobile, Snapdragon Mobile | MSM8996AU, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 | affected |
Weaknesses
- TOCTOU Vulnerabilities in Ontario Driver
ADP Enrichment
CVE Program Container
Additional References
- https://www.qualcomm.com/company/product-security/bulletins
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
References
- https://www.qualcomm.com/company/product-security/bulletins
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
Feedback
Was this page helpful?
Glad to hear it! Please tell us how we can improve.
Sorry to hear that. Please tell us how we can improve.