CVE-2017-18297
N/A
N/A
Summary
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Affected Software
| Vendor | Product | Version Range | Status |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Mobile | SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820 | affected |
Weaknesses
- Double Free in Trusted Application Environment
ADP Enrichment
CVE Program Container
Additional References
- https://www.qualcomm.com/company/product-security/bulletins
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
References
- https://www.qualcomm.com/company/product-security/bulletins
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
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