CVE-2015-9218
N/A
N/A
Summary
In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, when processing bad HEVC clips, the DPB fills, and with no error handling for DPB being full, a hang occurs.
Affected Software
| Vendor | Product | Version Range | Status |
|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Mobile, Snapdragon Wear | MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016 | affected |
Weaknesses
- Reachable Assertion in Video.
ADP Enrichment
CVE Program Container
Additional References
References
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